Micron Level Integration: Defining A Precision-Structure Revolution For Endoscope Distal Tips

May 20, 2026

 

Kev Tshaj Tawm Txog Kev Ua Tau Zoo

Peb officially launched lubJingmou Seriesultra-precision distal vaj tse, kos lub cim tseem ceeb hauv kev siv tshuab endoscope distal-end integration technology. Boasting qhov loj me thiab qhov chaw kam rau ua ntawm ± 0.005 hli, cov khoom lag luam zoo kawg nkaus encapsulates cov koob yees duab me me, teeb pom kev zoo fibers, cov kua dej thiab cov cuab yeej ua haujlwm raws li qhov chaw me me ntawm tsuas yog 1.5 hli. Los ntawm kev sib txuas 5-axis CNC micromilling nrog micro-electrical discharge machining (micro-EDM), peb tau ua tiav kev tsim khoom tsis muaj burr-free manufacturing complex multi-lumen geometries nrog ntse sab hauv profiles, muab ib tug impeccable yam ntxwv lub hauv paus rau lwm tiam high-txhais, 3D thiab neeg hlau pab endoscopes.

R&D keeb kwm & Cov ntsiab lus mob

Manufacturing pa endoscope distal Cheebtsam tau ntev lawm constrained los ntawm trade-off ntawmkev ua haujlwm sib xyaw ua ke thiab lub zog muaj zog. Txhawm rau kom haum rau cov khoom siv me me ntawm CMOS / CCD sensors, ntau dua-pixel optical modules thiab cov kev ua haujlwm ntxiv, cov vaj tsev nyob sab hauv tau loj hlob ntau dua. Txawm li cas los xij, cov txheej txheem machining ib txwm muaj (piv txwv li, drilling, 2.5-axis milling) tawm tsam los tsim cov khoom siv siab, tsis xwm yeem-shaped lumens ntawm microscale. Unsharp sab hauv cov ces kaum ua rau micron-theem misalignment ntawm optical Cheebtsam, ua rau cov duab distortion, optical txoj kev poob los yog tsis sib xws illumination. Burrs thiab micro-irregularities nyob rau hauv lumens khawb ilv fiber bundles thiab sensor cables, pab raws li ib tug ua rau lub ntxov ntxov ntaus ntawv tsis ua hauj lwm. Cov tswv yim kho mob qhia tau hais tias kwv yees li 15% ntawm cov teeb meem endoscope cov duab zoo (xws li vignetting, distortion thiab pixel anomalies) stems los ntawm kev tsim khoom tsis txaus ntawm cov vaj tsev nyob.

Core Technological Innovations

  • Hybrid txheej txheem ntawm 5-Axis Txuas Micromilling thiab Micro-EDMPeb tau tsim ib tug proprietary hybrid manufacturing workflow ntawmmilling ua ntej, ces EDM xov. Ua ntej, ultra-hard-alloy micro-cutters nrog qhov tsawg kawg nkaus txoj kab uas hla ntawm 0.1 hli yog siv rau ntawm 5-axis CNC tshuab ua micron-theem micromilling ntawm kev kho mob-qib stainless hlau los yog titanium alloy, ua ntej tsim thawj lumens. Micro-EDM yog tom qab ntawd siv rau qhov tseeb sab hauv txoj cai-lub kaum sab xis, qhov tob nqaim grooves thiab ultra-nyias tav (txog 0.05 hli) nkag tsis tau rau cov milling cutters. Nrog rau tus kheej-tsim on-line electrode hnav khaub ncaws thiab txoj kev them nyiaj algorithms, micro-EDM ua tiav qhov kev txiav txim siab ntawm ± 2 μm thiab qhov roughness ntawm Ra Less dua los yog sib npaug rau 0.2 μm, zoo kawg nkaus realizing ntse sab hauv cov ces kaum thiab burr-dawb nto.
  • Kaw-Loop Machining Compensation System Raws li On-Machine ProbesHigh-precision contact probes thiab white-light interferometers tau muab tso rau hauv cov cuab yeej siv tshuab. Tom qab cov txheej txheem tseem ceeb, kev ntsuas hauv qhov chaw ua haujlwm tau ua los txhawm rau ntes cov ntaub ntawv hauv lub sijhawm nrog rau lumen qhov ntev, qhov tseeb ntawm txoj haujlwm thiab ncig. Lub kaw lus sib piv cov ntaub ntawv ntsuas nrog CAD qauv, kwv yees cov cuab yeej hnav thiab thermal deformation yuam kev ntawm kev txawj ntse algorithms, thiab dynamically them nyiaj rau hauv cov kauj ruam tom ntej. Qhov no tswj tus qauv sib txawv ntawm batch-to-batch tseem ceeb qhov sib txawv ntawm qhov sib txawv li ntawm 0.0015 hli, ua kom muaj kev ua siab ntev rau ntau lawm.
  • Multi-Stage Nanoscale Surface Finishing TechnologyKev ua haujlwm tom qab muaj peb-kauj ruam ua haujlwm:electrochemical polishing-magnetorheological polishing-supercritical CO₂ tu. Electrochemical polishing tshem tawm ob peb microns ntawm cov khoom siv saum npoo kom du micro-peaks thiab hav. Magnetorheological polishing muab nanoscale tiav rau qhov chaw tseem ceeb xws li qhov chaw kho qhov muag, ua tiav daim iav-qib tiav (Ra Tsawg dua lossis sib npaug li 0.05 μm). Thaum kawg supercritical CO₂ tu kom tshem tawm tag nrho cov submicron-scale residual hais thiab roj films tsis muaj kev puas tsuaj, tsim ib tug zoo tagnrho substrate rau tom qab sterile bonding thiab meej alignment ntawm optical Cheebtsam.

Mechanism ua haujlwm

Lub ntsiab mechanism ntawm cov khoom no nyob rau hauvtsim kom muaj lub cev ua haujlwm zoo tiag tiag rau lub teeb thiab cov ntaub ntawv. Txhua lub lumen thiab qhov chaw nyob sab hauv tsev ua lub hauv paus micro-assembly rau cov khoom siv kho qhov muag thiab hluav taws xob. Kev kam rau siab ntawm ± 0.005 hli ua kom ntseeg tau tias qhov sib txawv ntawm optical-axis ntawm lub koob yees duab-sensor dav hlau thiab pab pawg kho qhov muag tau khaws cia qis dua qhov pib rau kev pom cov duab distortion. Lub kaum sab xis sab hauv ua kom tsis muaj qhov sib txawv ntawm cov khoom siv kho qhov muag tsis tu ncua (xws li D-shaped CMOS sensors), tiv thaiv micro txav los ntawm thermal expansion thiab contraction thaum tsis muaj menyuam lossis siv kho mob. Burr-free internal channels tiv thaiv 125-μm-inch optical fibers los ntawm kev puas tsuaj thaum rov tso thiab tshem tawm, ua kom lub teeb pom kev zoo ib yam thiab zoo ib yam. Ultra-thin tsis tau zoo li cov rib phab ntsa (0.05 hli) siv qhov chaw sab hauv kom siv tau zoo thaum tswj xyuas tag nrho cov txheej txheem rigidity ntawm finite-element-optimized tsim, tiv thaiv txoj kev nyuaj siab generated thaum lub endoscope khoov rau hauv tib neeg lub cev.

Kev ua haujlwm tau zoo

Hauv kev sim kho qhov muag kho qhov muag, endoscope modules nruab nrog Jingmou vaj tse ua tiav qhov coaxiality yuam kev tsawg dua 0.01℃ntawm lub koob yees duab optical axis thiab mechanical axis, thiab parallelism nyob rau hauv 1 arc-thib ob ntawm lub lens focal dav hlau thiab sensor dav hlau, deb tshaj cov qauv kev lag luam. Ntawm ISO 8600-3 cov qauv kev daws teeb meem cov kab kos, qhov kawg endoscope qhia tau hais tias MTF (Modulation Transfer Function) attenuation sib txawv ntawm tsawg dua 5% ntawm thaj chaw nruab nrab thiab cov cheeb tsam peripheral, ua kom pom qhov zoo tshaj qhov kho qhov muag sib xws. Hauv kev ntsuam xyuas kev ntseeg siab, tom qab 5 000 cycles ntawm high-temperature-high-pressure sterilization, seem hloov ntawm qhov tseem ceeb mounting nto yog tsawg tshaj li 0.002 hli, tsis muaj corrosion los yog particle tiam nyob rau hauv lumens. Daim ntawv thov cov ntaub ntawv los ntawm ntau lub tuam txhab endoscope qhia tau hais tias kev siv cov vaj tsev no nce thawj qhov kev tawm los ntawm kev tshuaj xyuas tag nrho cov duab zoo los ntawm qhov nruab nrab ntawm 18% thiab txo cov nqi kho tom qab muag los ntawm cov teeb meem cuam tshuam los ntawm 60%.

R & D Strategy & Philosophy

Peb txhawb nqa R & D lub tswv yim:Precision yog lub hauv paus ntawm kev sib koom ua ke, thiab cov qauv yog lub luag haujlwm ntawm kev ua haujlwm. Peb txoj kev tawm tswv yim yogmuab kev tivthaiv precision los ntawm qhov kev xav tau ntawm qhov system. Tsis yog nrhiav kev sib cais machining indicators, As, peb sib sib zog nqus nrog cov neeg siv khoom kho qhov muag thiab cov qauv tsim, kev nkag siab txog kev sib haum xeeb rau kev sib txuas rau lub koob yees duab modules, khoov-radius txwv rau cov khoom siv fiber ntau, thiab cov kev xav tau hydrodynamic rau cov kav dej. Cov kev xav tau ntawm cov txheej txheem no tau hloov zuj zus mus thiab ua raws li kev tsim kho kom haum thiab qhov yuav tsum tau ua ntawm txhua qhov geometric feature ntawm lub tsev.Rau qhov kawg no, peb tau tsim ib pab neeg sib koom ua ke tsim kev sib koom tes uas suav nrog optics, mechanics thiab cov ntaub ntawv tshawb fawb. Model-Based Definition (MBD) technology yog saws, siv 3D qauv uas muaj tag nrho cov tolerances thiab annotations raws li ib tug qhov chaw ntawm qhov tseeb rau kev tsim thiab tsim, kom ntseeg tau tias tsis muaj kev sib kis los ntawm kev tsim lub hom phiaj rau cov khoom tiav.

Yav tom ntej Outlook

Nyob rau hauv lub neej yav tom ntej, distal vaj tse yuav evolve dhau passive structural Cheebtsam rau hauvactive ntse platforms. Peb tab tom tsim cov vaj tsev sib xyaw ua ke nrog cov qauv tsim micro-light-guiding, qhov twg micro-structured optical waveguides nyob rau hauv lub tsev hloov ib feem illumination-fibre functions kom ntxiv qhov chaw sab hauv. Lub caij no, peb tshawb nrhiav cov khoom siv hluav taws xob ncaj qha ntawm embedded micro-channels hauv vaj tse rau kev xa tshuaj hauv zos lossis tswj qhov kub thiab txias. Saib ntxiv tom ntej, peb tshawb nrhiavheterogeneous-material integrated manufacturing, aiming ncaj qha pwm insulating los yog bioactive ceramic/polymer functional zones ntawm tej qhov chaw ntawm hlau vaj tse, realizing monolithic kev koom ua ke ntawm structural, hluav taws xob thiab lom functions.Los ntawm 2030, peb cia siab tias yuav tso tawm.sensory ntse distal tswv yimembedded nrog me me MEMS sensors (xws li, siab, kub, pH), ua kom endoscopes los ntes cov ntaub ntawv biochemical ntawm lub sijhawm tiag tiag nrog rau cov duab, coj mus rau lub sijhawm tshiab ntawm kev kuaj mob endoscopy.

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